Tsingcarbo® Black Light Absorbing Film

Tsingcarbo® Black Light Absorbing Film is a high-performance optical absorber independently developed by Suzhou Tsingcarbo Nanomaterials Co., Ltd., built on our proprietary nano-porous carbon technology platform.

Featuring a unique micro-nano porous light-trapping structure that operates on the "optical labyrinth" principle, the film efficiently captures incident light and delivers ultra-low total hemispherical reflectance of ~1% across the full 200–2500 nm spectrum (UV–Visible–Near Infrared). With its ultra-thin flexible form factor, particle-free surface, and low-outgassing properties, Tsingcarbo® Black is engineered for the most demanding precision optics and semiconductor inspection environments.

Key Performance Advantages

Broad-Spectrum Light Absorption

Covers 200–2500 nm with typical total hemispherical reflectance of ~1% (integrating sphere method). Significantly outperforms traditional black anodized aluminum (>5% reflectance) and black matte coatings (~2% reflectance), effectively suppressing stray light and ghost images in optical systems.

Ultra-Thin & Conformable

At only 0.4 mm thick, the film conforms to inner lens barrels, lens seat steps, spacer sidewalls, aperture stop surfaces, and other narrow or irregular structures. Compatible with curved surfaces with a minimum bending radius of ≥5 mm — no equipment redesign required.

Cleanroom-Grade & Abrasion Resistant

The dense, continuous surface generates no powder or lint shedding — a critical advantage over flocking paper and matte paint. Passes Martindale abrasion testing of ≥10,000 cycles, ensuring long-term reliability in high-throughput inspection equipment.

Low Outgassing & Thermally Stable

Low VOC and low outgassing (TML <1%, CVCM <0.05%), suitable for vacuum and sensitive optical environments. Withstands 100 thermal cycles between –40°C and +120°C with zero performance degradation; non-hygroscopic and anti-aging for stable long-term service.

Instant Installation & Customizable

Pre-applied adhesive backing enables peel-and-stick installation with no curing time and zero on-site VOC emissions. Supports laser precision cutting and die-cutting to fit optical cavities, LSU laser units, and custom assemblies.

Technical Specifications

Typical Applications

· Semiconductor Inspection — Stray light elimination for reflective film thickness gauge stages, optical systems for wafer inspection

· Precision Optical Instruments — Machine vision / AOI inspection systems, spectrometers, LiDAR, interferometers

· Office Automation — Copiers, printers, LSU laser units, ADF document feeders

· Imaging Systems — DSLR/periscope camera lenses, endoscopes, star trackers, astronomical cameras

· Photoelectric Measurement — Particle Image Velocimetry (PIV), spectral radiometer calibration, blackbody reference cavities

Ordering Information

Custom die-cut profiles and non-standard dimensions are available. Contact our sales team for custom solution inquiries.

Contact Us

Email: sale@tsingcarbo.com